MC74VHC1GT66DTT3
vs
SN74LVC1G66YEAR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
LESHAN RADIO CO LTD
ROCHESTER ELECTRONICS LLC
Package Description
TSOP, TSOP5/6,.11,37
DSBGA-5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-PDSO-G5
R-XBGA-B5
Normal Position
NO
Number of Functions
1
1
Number of Terminals
5
5
On-state Resistance-Max (Ron)
100 Ω
20 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSOP
VFBGA
Package Equivalence Code
TSOP5/6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.95 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
BGA
Pin Count
5
Analog IC - Other Type
SPST
JESD-609 Code
e0
Length
1.4 mm
Moisture Sensitivity Level
1
Number of Channels
1
Off-state Isolation-Nom
42 dB
Peak Reflow Temperature (Cel)
260
Seated Height-Max
0.5 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
Supply Voltage-Nom (Vsup)
2.3 V
Switch-off Time-Max
6.9 ns
Switch-on Time-Max
6.5 ns
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
0.9 mm
Compare MC74VHC1GT66DTT3 with alternatives
Compare SN74LVC1G66YEAR with alternatives