MC74VHC1G32DBVT1G
vs
MC74HC1G32DTT2
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Manufacturer Package Code |
318BQ
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
|
Family |
AHC/VHC
|
HC/UH
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
3 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
OR GATE
|
OR GATE
|
Max I(ol) |
0.008 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP
|
TSOP
|
Package Equivalence Code |
TSOP5/6,.11,37
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
0.04 mA
|
|
Prop. Delay@Nom-Sup |
10 ns
|
|
Propagation Delay (tpd) |
15.5 ns
|
155 ns
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.5 mm
|
1.5 mm
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
TSOP
|
Package Description |
|
TSOP,
|
Pin Count |
|
5
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MC74VHC1G32DBVT1G with alternatives
Compare MC74HC1G32DTT2 with alternatives