MC74VHC02MR2 vs TC74HC02AF(TP2) feature comparison

MC74VHC02MR2 onsemi

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TC74HC02AF(TP2) Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, 0.300 INCH, PLASTIC, SOIC-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family AHC/VHC HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Length 10.2 mm 10.3 mm
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 13 ns 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.3 mm
Base Number Matches 3 1
Pbfree Code No
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74HC02AF(TP2) with alternatives