MC74LVX32DTR2
vs
74LVC32APW-Q100/CU
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NEXPERIA
|
| Package Description |
TSSOP, TSSOP14,.25
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G14
|
|
| JESD-609 Code |
e0
|
e4
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Max I(ol) |
0.004 A
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
11.5 ns
|
|
| Propagation Delay (tpd) |
17 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
NICKEL PALLADIUM GOLD SILVER
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
4.4 mm
|
|
| Base Number Matches |
4
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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