MC74LVX138MR2
vs
TC74LVX138FN(ELP)
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
10.2 mm
9.9 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
1.75 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
5.275 mm
3.9 mm
Base Number Matches
3
1
Pbfree Code
No
Additional Feature
3 ENABLE INPUTS
Load Capacitance (CL)
50 pF
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74LVX138MR2 with alternatives
Compare TC74LVX138FN(ELP) with alternatives