MC74LVX138M vs TC74LVX138FNELP feature comparison

MC74LVX138M onsemi

Buy Now Datasheet

TC74LVX138FNELP Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Lifetime Buy
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.3 0.150 INCH, PLASTIC, MS-012AC, SOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 10.2 mm 9.9 mm
Logic IC Type 3-LINE TO 8-LINE DECODER OTHER DECODER/DRIVER
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 14 ns
Propagation Delay (tpd) 20 ns 14 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 3.9 mm
Base Number Matches 4 1
Pbfree Code No
Additional Feature 3 ENABLE INPUTS
Load Capacitance (CL) 50 pF
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74LVX138M with alternatives

Compare TC74LVX138FNELP with alternatives