MC74LVX00DR2
vs
MC74LVX00MELG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
10.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
16 ns
16 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
5.275 mm
Base Number Matches
3
1
Rohs Code
JESD-609 Code
e4
Max I(ol)
0.004 A
Moisture Sensitivity Level
3
Package Equivalence Code
SOP14,.3
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
11 ns
Schmitt Trigger
NO
Supply Voltage-Nom (Vsup)
2.7 V
Terminal Finish
NICKEL PALLADIUM GOLD
Compare MC74LVX00DR2 with alternatives
Compare MC74LVX00MELG with alternatives