MC74LVQ74SD
vs
TC74LVQ74FELP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MOTOROLA INC
TOSHIBA CORP
Part Package Code
SSOP
SOIC
Package Description
SSOP, SSOP14,.3
0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-14
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LVQ
LVQ
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e0
Length
6.2 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
95000000 Hz
Max I(ol)
0.012 A
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Equivalence Code
SSOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Prop. Delay@Nom-Sup
16 ns
Propagation Delay (tpd)
18 ns
16 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.9 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.3 mm
5.3 mm
fmax-Min
125 MHz
65 MHz
Base Number Matches
1
2
Pbfree Code
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74LVQ74SD with alternatives
Compare TC74LVQ74FELP with alternatives