MC74LCX574DT
vs
HD74LVC574AFP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
HITACHI LTD
Package Description
TSSOP,
SOP, SOP20,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BROADSIDE VERSION OF 374
BROADSIDE VERSION OF 374
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
Length
6.5 mm
12.6 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
9.5 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.2 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.5 mm
Base Number Matches
5
2
Part Package Code
SOIC
Pin Count
20
Max Frequency@Nom-Sup
100000000 Hz
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP20,.3
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
8.5 ns
Time@Peak Reflow Temperature-Max (s)
20
Trigger Type
POSITIVE EDGE
Compare HD74LVC574AFP with alternatives