MC74LCX573M
vs
SN74LVC573AGQNR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ROCHESTER ELECTRONICS LLC
Part Package Code
SOIC
BGA
Package Description
SOP,
PLASTIC, VFBGA-20
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
BROADSIDE VERSION OF 373
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PBGA-B20
JESD-609 Code
e0
e0
Length
12.575 mm
4 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd)
9.5 ns
22.8 ns
Qualification Status
Not Qualified
Seated Height-Max
2.05 mm
1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
BOTTOM
Width
5.275 mm
3 mm
Base Number Matches
2
1
Rohs Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74LCX573M with alternatives
Compare SN74LVC573AGQNR with alternatives