MC74LCX374M
vs
HD74LVC374AT-EL
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
RENESAS TECHNOLOGY CORP
Part Package Code
SOIC
SOIC
Package Description
EIAJ, PLASTIC, SOIC-20
TSSOP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
Length
12.575 mm
6.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
NOT SPECIFIED
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
9.5 ns
9.5 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
2.05 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.275 mm
4.4 mm
Base Number Matches
5
2
HTS Code
8542.39.00.01
Compare MC74LCX374M with alternatives
Compare HD74LVC374AT-EL with alternatives