MC74LCX258DTR2
vs
74LVC1G157GW,125
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
TSSOP,
|
PLASTIC, SC-88, SOT-363, 6 PIN
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G6
|
Length |
5 mm
|
2 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
4
|
1
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
6
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
INVERTED
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
9 ns
|
13 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
2.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
1.25 mm
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
Yes
|
Part Package Code |
|
TSSOP
|
Pin Count |
|
6
|
Manufacturer Package Code |
|
SOT363
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e3
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.024 A
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
TSSOP6,.08
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
6.3 ns
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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