MC74LCX258DTG vs MC74LCX158D feature comparison

MC74LCX258DTG onsemi

Buy Now Datasheet

MC74LCX158D Motorola Mobility LLC

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ONSEMI MOTOROLA INC
Part Package Code TSSOP-16 SOIC
Package Description TSSOP-16 SOP,
Pin Count 16 16
Manufacturer Package Code 948F-01
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 5 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.5 ns
Propagation Delay (tpd) 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2.7 V
Supply Voltage-Nom (Vsup) 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 3.9 mm
Base Number Matches 1 4

Compare MC74LCX258DTG with alternatives

Compare MC74LCX158D with alternatives