Findchips: Compare MC74LCX258DTEL vs TC74LCX157FN

MC74LCX258DTEL vs TC74LCX157FN feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	TOSHIBA CORP
Part Package Code	TSSOP	SOIC
Package Description	TSSOP,	SOP, SOP16,.25
Pin Count	16	16
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	LVC/LCX/Z	LVC/LCX/Z
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
Length	5 mm	9.9 mm
Logic IC Type	MULTIPLEXER	MULTIPLEXER
Number of Functions	4	4
Number of Inputs	2	2
Number of Outputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	3-STATE
Output Polarity	INVERTED	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Propagation Delay (tpd)	9 ns	6.3 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.2 mm	1.75 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	2.3 V	2.7 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	4.4 mm	3.9 mm
Base Number Matches	3	1
Pbfree Code		Yes
Rohs Code		Yes
Samacsys Manufacturer		Toshiba
Additional Feature		NOT AVAILABLE IN JAPAN
Load Capacitance (CL)		50 pF
Max I(ol)		0.024 A
Package Equivalence Code		SOP16,.25
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Prop. Delay@Nom-Sup		5.8 ns
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » Multiplexer/Demultiplexers	Logic » Multiplexer/Demultiplexers