MC74LCX258D
vs
MC74LCX257SD
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
SOIC
Package Description
SOIC-16
SSOP, SSOP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
9.9 mm
6.2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
NOT SPECIFIED
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
Propagation Delay (tpd)
8.5 ns
6.5 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
2.7 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
5.3 mm
Base Number Matches
4
4
Rohs Code
No
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
SSOP16,.3
Prop. Delay@Nom-Sup
6 ns