MC74LCX258D
vs
74LVC157APW-T
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOIC-16
TSSOP,
Pin Count
16
Reach Compliance Code
unknown
unknown
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
e4
Length
9.9 mm
5 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
NOT SPECIFIED
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Propagation Delay (tpd)
8.5 ns
7.5 ns
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.2 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
4.4 mm
Base Number Matches
4
3
Rohs Code
HTS Code
8542.39.00.01
Load Capacitance (CL)
50 pF
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