MC74LCX257SDR2
vs
SN74LVC158ADBLE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SSOP,
SSOP, SSOP16,.3
Pin Count
16
16
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
6.2 mm
6.2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)
8.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
5.3 mm
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
SSOP16,.3
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74LCX257SDR2 with alternatives
Compare SN74LVC158ADBLE with alternatives