MC74LCX158M
vs
SN74LVC2G157BDCT
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.3
|
LSSOP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Length |
10.2 mm
|
2.95 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LSSOP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
6.5 ns
|
|
| Propagation Delay (tpd) |
8.5 ns
|
7.1 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
1.3 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.275 mm
|
2.8 mm
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare MC74LCX158M with alternatives
Compare SN74LVC2G157BDCT with alternatives