MC74LCX157SDR2
vs
SNJ54LVC157AFK
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
QLCC
Package Description
SSOP,
QCCN, LCC20,.35SQ
Pin Count
16
20
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
S-CQCC-N20
Length
6.2 mm
8.89 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SSOP
QCCN
Package Equivalence Code
SSOP16,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
2.03 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
5.29 mm
8.89 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Packing Method
TUBE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
5.4 ns
Propagation Delay (tpd)
6.2 ns
Screening Level
MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74LCX157SDR2 with alternatives
Compare SNJ54LVC157AFK with alternatives