MC74LCX139MELG
vs
M54HC137F1R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
STMICROELECTRONICS
Part Package Code
SOIC
DIP
Package Description
SOP, SOP16,.3
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
HC/UH
Input Conditioning
STANDARD
LATCHED
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e4
e0
Length
10.2 mm
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.024 A
0.004 A
Moisture Sensitivity Level
3
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.01 mA
Prop. Delay@Nom-Sup
6.2 ns
41 ns
Propagation Delay (tpd)
9.3 ns
110 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
5.08 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.275 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Additional Feature
ADDRESS LATCHES; 2 ENABLE INPUTS
Load Capacitance (CL)
50 pF
Compare MC74LCX139MELG with alternatives
Compare M54HC137F1R with alternatives