MC74LCX138DTG vs 74LVC138APW,112 feature comparison

MC74LCX138DTG Rochester Electronics LLC

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74LVC138APW,112 NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description LEAD FREE, TSSOP-16 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
Additional Feature 3 ENABLE INPUTS
Family LVC/LCX/Z LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 5 mm 5 mm
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 7.2 ns 8.5 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.5 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT403-1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code TSSOP16,.25
Packing Method BULK
Prop. Delay@Nom-Sup 7.5 ns

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