MC74HCT573ADW vs TC74HCT573AFW(TP2) feature comparison

MC74HCT573ADW onsemi

Buy Now Datasheet

TC74HCT573AFW(TP2) Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP20,.4 0.300 INCH, PLASTIC, SOIC-20
Pin Count 20 20
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 225 240
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 45 ns 46 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn80Pb20)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 7.5 mm 7.5 mm
Base Number Matches 4 3
Pbfree Code No
Additional Feature BROADSIDE VERSION OF 373; ENABLE TIME @ RL=1K

Compare MC74HCT573ADW with alternatives

Compare TC74HCT573AFW(TP2) with alternatives