MC74HCT374ASDR2 vs 74HCT541DB-T feature comparison

MC74HCT374ASDR2 Motorola Mobility LLC

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74HCT541DB-T NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SSOP SSOP
Package Description SSOP, SSOP, SSOP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 7.2 mm 7.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 47 ns 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.3 mm 5.3 mm
Base Number Matches 2 1
Rohs Code Yes
Additional Feature WITH DUAL OUTPUT ENABLE
Control Type ENABLE LOW
JESD-609 Code e4
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP20,.3
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 42 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 74HCT541DB-T with alternatives