MC74HCT244AF vs TC74HCT244AF(TP1) feature comparison

MC74HCT244AF onsemi

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TC74HCT244AF(TP1) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description EIAJ, SOIC-20 SOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 12.575 mm 12.8 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 3
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 30 ns
Propagation Delay (tpd) 30 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.8 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.3 mm
Base Number Matches 2 1
Pbfree Code No
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HCT244AF with alternatives

Compare TC74HCT244AF(TP1) with alternatives