MC74HCT138ADG vs TC74HC137AF-TP2 feature comparison

MC74HCT138ADG onsemi

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TC74HC137AF-TP2 Toshiba America Electronic Components

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Pbfree Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code SOIC 16 LEAD SOIC
Package Description SOIC-16 SOP,
Pin Count 16 16
Manufacturer Package Code 751B-05
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HCT HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3 e0
Length 9.9 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 45 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 5.3 mm
Base Number Matches 1 3
Rohs Code No
Additional Feature ADDRESS LATCHES; 2 ENABLE INPUTS

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