MC74HC85ND
vs
HD74HC85P-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CASCADABLE
CASCADABLE
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e4
Length
19.175 mm
19.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
69 ns
265 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
5.06 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
1
Pbfree Code
Rohs Code
Moisture Sensitivity Level
1
Compare MC74HC85ND with alternatives
Compare HD74HC85P-E with alternatives