MC74HC688DWDS
vs
HD74HC688RP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Package Description
SOP, SOP20,.4
SOP,
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
Logic IC Type
MAGNITUDE COMPARATOR
IDENTITY COMPARATOR
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP20,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Pbfree Code
Part Package Code
SOIC
Pin Count
20
Additional Feature
CASCADABLE
Family
HC/UH
Length
12.8 mm
Number of Bits
8
Number of Functions
1
Output Polarity
INVERTED
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
265 ns
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.5 mm
Compare MC74HC688DWDS with alternatives
Compare HD74HC688RP with alternatives