MC74HC688DW
vs
GD74HC688D
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
LG SEMICON CO LTD
|
Package Description |
SOP, SOP20,.4
|
SOP, SOP20,.4
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
MAGNITUDE COMPARATOR
|
MAGNITUDE COMPARATOR
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP20,.4
|
SOP20,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Supplies |
2/6 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
2
|
HTS Code |
|
8542.39.00.01
|
|
|
|