MC74HC574AN vs 74HC574N feature comparison

MC74HC574AN Motorola Mobility LLC

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74HC574N NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, PLASTIC, MS-001, SC-603, SOT146-1, DIP-20
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T20 R-PDIP-T20
JESD-609 Code e0 e4
Length 26.415 mm 26.73 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 48 ns 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
ECCN Code EAR99
Samacsys Manufacturer NXP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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