MC74HC563AN vs MM74HC563J feature comparison

MC74HC563AN Motorola Semiconductor Products

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MM74HC563J Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NATIONAL SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP20,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 533 BROADSIDE VERSION OF 533
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T20 R-GDIP-T20
JESD-609 Code e0 e0
Length 26.415 mm 24.51 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 175 ns 47 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code DIP
Pin Count 20
Load Capacitance (CL) 150 pF
Package Equivalence Code DIP20,.3

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