MC74HC4066DT
vs
CD4052BFMS
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
INTERSIL CORP
|
| Part Package Code |
TSSOP
|
DIP
|
| Package Description |
TSSOP,
|
DIP,
|
| Pin Count |
14
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
5 mm
|
|
| Number of Channels |
1
|
4
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
40 dB
|
|
| On-state Resistance-Max (Ron) |
130 Ω
|
1050 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
5.08 mm
|
| Supply Current-Max (Isup) |
0.16 mA
|
|
| Supply Voltage-Nom (Vsup) |
12 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
15 ns
|
210 ns
|
| Switch-on Time-Max |
15 ns
|
320 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
|
|
|
Compare MC74HC4066DT with alternatives
Compare CD4052BFMS with alternatives