MC74HC4066DR2
vs
HEF4051BT-Q100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOP, SOP14,.25
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-PDSO-G14
JESD-609 Code
e0
e4
Length
8.65 mm
Normal Position
NO
Number of Channels
1
Number of Functions
4
Number of Terminals
14
Off-state Isolation-Nom
40 dB
On-state Resistance Match-Nom
20 Ω
On-state Resistance-Max (Ron)
130 Ω
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Output
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
Package Code
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Qualification Status
Not Qualified
Seated Height-Max
1.75 mm
Supply Current-Max (Isup)
0.16 mA
Supply Voltage-Nom (Vsup)
12 V
Surface Mount
YES
Switch-off Time-Max
15 ns
Switch-on Time-Max
15 ns
Switching
MAKE-BEFORE-BREAK
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Width
3.9 mm
Base Number Matches
1
2
Rohs Code
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
AEC-Q100
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74HC4066DR2 with alternatives
Compare HEF4051BT-Q100 with alternatives