MC74HC4066ANG vs 74HC4066NB feature comparison

MC74HC4066ANG onsemi

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74HC4066NB NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e3
Length 18.86 mm 19.025 mm
Normal Position NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 40 dB 50 dB
On-state Resistance Match-Nom 20 Ω 5 Ω
On-state Resistance-Max (Ron) 120 Ω 95 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 4.2 mm
Supply Voltage-Max (Vsup) 12 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Switch-off Time-Max 60 ns 30 ns
Switch-on Time-Max 45 ns 20 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Supply Current-Max (Isup) 0.08 mA

Compare MC74HC4066ANG with alternatives

Compare 74HC4066NB with alternatives