MC74HC373DWR2 vs 74HC373D,652 feature comparison

MC74HC373DWR2 Motorola Mobility LLC

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74HC373D,652 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SOIC SOP
Package Description SOP, 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 53 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT163-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP20,.4
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74HC373DWR2 with alternatives

Compare 74HC373D,652 with alternatives