MC74HC32AN vs GD54HC32 feature comparison

MC74HC32AN onsemi

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GD54HC32 Goldstar Electron Co Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI GOLDSTAR ELECTRON CO LTD
Part Package Code DIP
Package Description PLASTIC, DIP-14 ,
Pin Count 14
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0
Length 18.86 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 235
Prop. Delay@Nom-Sup 22 ns
Propagation Delay (tpd) 110 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm
Base Number Matches 2 6

Compare MC74HC32AN with alternatives

Compare GD54HC32 with alternatives