MC74HC244ADTR2
vs
HCS244DMSH
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
INTERSIL CORP
Package Description
TSSOP,
DIP, DIP20,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PDSO-G20
R-XDIP-T20
Length
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
4
4
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Propagation Delay (tpd)
27 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
Base Number Matches
3
2
Rohs Code
Part Package Code
DIP
Pin Count
20
Control Type
ENABLE LOW
JESD-609 Code
e0
Max I(ol)
0.005 A
Package Equivalence Code
DIP20,.3
Power Supply Current-Max (ICC)
3.75 mA
Prop. Delay@Nom-Sup
32 ns
Screening Level
38535V;38534K;883S
Terminal Finish
Tin/Lead (Sn/Pb)
Total Dose
1M Rad(Si) V