MC74HC20DDR2 vs HD74HC20FPEL feature comparison

MC74HC20DDR2 Motorola Semiconductor Products

Buy Now Datasheet

HD74HC20FPEL Renesas Electronics Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Package Description SOP, SOP, SOP14,.3
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 2 2
Number of Inputs 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 27 ns 115 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.5 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 23 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 20

Compare MC74HC20DDR2 with alternatives

Compare HD74HC20FPEL with alternatives