MC74HC20DD
vs
HD74HC20FPEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
RENESAS ELECTRONICS CORP
Package Description
SOP, SOP14,.25
SOP, SOP14,.3
Reach Compliance Code
unknown
compliant
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
Logic IC Type
NAND GATE
NAND GATE
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Power Supplies
2/6 V
Schmitt Trigger
NO
NO
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
1
Pbfree Code
Part Package Code
SOIC
Pin Count
14
HTS Code
8542.39.00.01
Family
HC/UH
Length
10.06 mm
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
2
Number of Inputs
4
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
23 ns
Propagation Delay (tpd)
115 ns
Qualification Status
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
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