MC74HC153ADG
vs
CD54HCT153F3A
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ONSEMI
INTERSIL CORP
Part Package Code
SOIC 16 LEAD
Package Description
SOIC-16
DIP, DIP16,.3
Pin Count
16
Manufacturer Package Code
751B-05
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
2 Days
Samacsys Manufacturer
onsemi
Family
HC/UH
JESD-30 Code
R-PDSO-G16
R-XDIP-T16
JESD-609 Code
e3
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
42 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
1
4
Rohs Code
Screening Level
38535Q/M;38534H;883B
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