MC74HC132AND
vs
935185800118
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
NEXPERIA
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP14,.3
|
TSSOP,
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e4
|
Length |
18.86 mm
|
5 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
TSSOP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Prop. Delay@Nom-Sup |
31 ns
|
|
Propagation Delay (tpd) |
38 ns
|
190 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
YES
|
|
Seated Height-Max |
4.69 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
4.4 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
Packing Method |
|
TR, 13 INCH
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC74HC132AND with alternatives
Compare 935185800118 with alternatives