MC74HC126ADR2 vs 74CBTLV3126BQ-Q100 feature comparison

MC74HC126ADR2 Motorola Mobility LLC

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74CBTLV3126BQ-Q100 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SOIC QFN
Package Description SOP, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, QFN-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE HIGH
Family HC/UH CBTLV/3B
JESD-30 Code R-PDSO-G14 R-PQCC-N14
JESD-609 Code e0 e4
Length 8.65 mm 3 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0078 A
Number of Bits 1 1
Number of Functions 4 4
Number of Ports 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVQCCN
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TAPE AND REEL
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 180 ns
Propagation Delay (tpd) 27 ns 0.31 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2.3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL QUAD
Width 3.9 mm 2.5 mm
Base Number Matches 1 2
Rohs Code Yes
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC126ADR2 with alternatives

Compare 74CBTLV3126BQ-Q100 with alternatives