MC74HC11ADT
vs
933714290653
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
NXP SEMICONDUCTORS
Package Description
TSSOP, TSSOP14,.25
SO-14
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.0024 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
75 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
SOIC
Pin Count
14
HTS Code
8542.39.00.01
Family
HC/UH
Length
8.65 mm
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
150 ns
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
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