MC74HC02AFR1 vs 74HC02DB,118 feature comparison

MC74HC02AFR1 Rochester Electronics LLC

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74HC02DB,118 NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description EIAJ, SOIC-14 SSOP, SSOP14,.3
Pin Count 14 14
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Logic IC Type NOR GATE NOR GATE
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 110 ns 27 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT337-1
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SSOP14,.3
Packing Method TR
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO

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