MC74HC02AFEL vs TC74HC02AF(TP2) feature comparison

MC74HC02AFEL onsemi

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TC74HC02AF(TP2) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.3 0.300 INCH, PLASTIC, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e0
Length 10.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 22 ns
Propagation Delay (tpd) 110 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 2.05 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.3 mm
Base Number Matches 2 3
Pbfree Code No
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC02AFEL with alternatives

Compare TC74HC02AF(TP2) with alternatives