MC74HC00ADR2 vs TC74HCT00AFN feature comparison

MC74HC00ADR2 Motorola Mobility LLC

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TC74HCT00AFN Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 22 ns 24 ns
Propagation Delay (tpd) 22 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 5 1
Pbfree Code Yes
Rohs Code Yes
Additional Feature NOT AVAILABLE IN JAPAN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HC00ADR2 with alternatives

Compare TC74HCT00AFN with alternatives