MC74F827N
vs
AM29C827APC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
WITH DUAL OUTPUT ENABLE
WITH DUAL OUTPUT ENABLE
Control Type
ENABLE LOW
ENABLE LOW
Family
F/FAST
CMOS
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e0
Length
31.69 mm
30.734 mm
Load Capacitance (CL)
50 pF
300 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.064 A
0.048 A
Number of Bits
10
10
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
100 mA
Prop. Delay@Nom-Sup
10 ns
7.5 ns
Propagation Delay (tpd)
9 ns
15.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Compare MC74F827N with alternatives
Compare AM29C827APC with alternatives