MC74F779JD vs 933828990623 feature comparison

MC74F779JD Motorola Mobility LLC

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933828990623 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO OUTPUT; MULTIPLEXED I/O
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Length 19.3 mm 10.3 mm
Load Capacitance (CL) 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 128 mA
Propagation Delay (tpd) 11 ns 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.5 mm
fmax-Min 80 MHz 115 MHz
Base Number Matches 1 1

Compare MC74F779JD with alternatives

Compare 933828990623 with alternatives