MC74F779DR2
vs
N74F1779N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT; MULTIPLEXED I/O
Count Direction
BIDIRECTIONAL
BIDIRECTIONAL
Family
F/FAST
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
Load/Preset Input
YES
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
80000000 Hz
100000000 Hz
Max I(ol)
0.024 A
0.024 A
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Power Supply Current-Max (ICC)
128 mA
155 mA
Propagation Delay (tpd)
11 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Width
3.9 mm
fmax-Min
80 MHz
Base Number Matches
3
3
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