MC74F37J
vs
54F37/BCA
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP,
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IOH = 15MA @ VOH = 2V; IOL = 64MA @ VOL = 0.55V
|
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T14
|
R-GDIP-T14
|
| Length |
19.495 mm
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
5 ns
|
5.5 ns
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
4
|
3
|
| Load Capacitance (CL) |
|
50 pF
|
| Power Supply Current-Max (ICC) |
|
33 mA
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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