MC74F257ADR2
vs
MC74F257N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
SOP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Power Supply Current-Max (ICC)
22 mA
23 mA
Propagation Delay (tpd)
8 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.44 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
7.62 mm
Base Number Matches
3
3
Max I(ol)
0.024 A
Package Equivalence Code
DIP16,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Prop. Delay@Nom-Sup
15 ns
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74F257ADR2 with alternatives
Compare MC74F257N with alternatives